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Low Temperature Sintering of Nano solder for High Temperature packaging Applications
Keywords: Nano solder, Intermetallic Compounds, Sinter
With the increase of power density of electric devices, the bonding materials are being challenged by the higher current density and the higher working temperatures. In order to replace the toxic Pb-rich solder and prevent high temperature failure in interconnections, high temperature Lead-free bonding materials which can serve reliably are desirable. This paper reports a novel kind of nano solder made of Cu6Sn5, which is the most common intermetallic compound in conventional solder bumps and costs less than Sn based solder. By making Cu6Sn5 into nano particles smaller than 10nm, the sintering temperature of this nano solder can be as low as 200℃ because of the nano-induced suppressed melting point. After the sintering procedure, the intermetallic can recover its high melting point and other good characters of the bulk material. This makes a novel kind of bonding material which can work at a temperature higher than its sintering temperature.
Ying Zhong, PhD Candidate
UC San Diego
San Diego, CA

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems