Here is the abstract you requested from the socal_2015 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Low Temperature Sintering of Nano solder for High Temperature packaging Applications|
|Keywords: Nano solder, Intermetallic Compounds, Sinter|
|With the increase of power density of electric devices, the bonding materials are being challenged by the higher current density and the higher working temperatures. In order to replace the toxic Pb-rich solder and prevent high temperature failure in interconnections, high temperature Lead-free bonding materials which can serve reliably are desirable. This paper reports a novel kind of nano solder made of Cu6Sn5, which is the most common intermetallic compound in conventional solder bumps and costs less than Sn based solder. By making Cu6Sn5 into nano particles smaller than 10nm, the sintering temperature of this nano solder can be as low as 200℃ because of the nano-induced suppressed melting point. After the sintering procedure, the intermetallic can recover its high melting point and other good characters of the bulk material. This makes a novel kind of bonding material which can work at a temperature higher than its sintering temperature.|
|Ying Zhong, PhD Candidate
UC San Diego
San Diego, CA