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“High reliability die attach solutions for automotive applications”
Keywords: conductive, high-reliability, film
Abstract Recent recalls in the automotive industry have reinforced the need for higher reliability components. Applications such as air bag sensors and electronic system have reinforced the importance of high levels of reliability for automotive customers. JEDEC JESD22- A104D Temperature Cycle Standards is just one such example where the automotive industry is pushing for severe reliability testing requirements. This paper will focus on presenting high reliability Conductive Die Attach Film (cDAF) technology for large die applications ranging from 1x1 mm2 to 10x10mm2. Key benefits of this technology include zero delamination after Moisture Sensitivity Level 1 (MSL 1) and more than 2000 board-level temperature cycles. This technology platform meets these requirements by introducing materials with high adhesion, excellent moisture resistance capability, and lower warpage (low modulus). In addition, the controlled flow characteristics of the conductive film platform enable design latitude to reduce package sizes while increasing the number of chips in the package, along with a clean, robust process with minimal material squeeze-out, no fillet and no die tilt.
Andrew Laib and Mina Chow-Taing, Technical Service Engineer
Henkel Electronic Materials, LLC
Irvine, Ca

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