Here is the abstract you requested from the socal_2015 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Some Progress in Power Electronic Packaging for EV/HEV applications|
|Keywords: Power electronic packaging, Heat sink, EV/HEV|
|Power inverter module is a critical component in hybrid/electric powertrain systems. The module needs to transfer tens or ~100 kW of power to drive the motors. Recently, there has been a lot of progress in power electronic packaging for EV/HEV applications toward the direction of cheaper, higher power density(smaller), yet reliable for 10 years/100,000 miles. The presentation will first discuss several packaging technologies in Toyota Prius, Nissan Leaf, VW prototype, as well as power modules by Hitachi, Denso, and Delphi. Those technologies include Ag sintering, double side cooling, new substrate technology. Then the presentation will discuss in more detail about the trend that Al heat sink is replacing Cu heat sink in EV/HEV inverter power modules such as Nissan Leaf and Toyota Prius. A quantitative comparison will be presented in terms of thermal performance, cost, manufacturing, and reliability.|
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