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Advances in Optical Metrology for Fan-Out Wafer-Level Packaging
Keywords: FOWLP, 2.5D, Interposer
Fan-Out Wafer Level Packaging (FOWLP) technology provides a cost effective solution for semiconductor devices requiring a smaller package footprint with higher input / output (I/O) along with improved thermal and electrical performance. Compared to conventional wafer level packaging, FOWLP presents difficult challenges to traditional optical metrology tools due to a higher degree of wafer warpage, smaller RDL critical dimensions, and lower reflectivity of epoxy mold compound (EMC). In this presentation, we will describe a new, patented optical metrology solution developed by Zeta Instruments that overcomes these challenges and give real-world examples of its effectiveness on FOWLP applications such as 2um RDL profiling and polyimide thickness measurement over black EMC.
Jeff Donnelly, COO
Zeta Instruments
San Jose, CA

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