Here is the abstract you requested from the socal_2015 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Advances in Optical Metrology for Fan-Out Wafer-Level Packaging|
|Keywords: FOWLP, 2.5D, Interposer|
|Fan-Out Wafer Level Packaging (FOWLP) technology provides a cost effective solution for semiconductor devices requiring a smaller package footprint with higher input / output (I/O) along with improved thermal and electrical performance. Compared to conventional wafer level packaging, FOWLP presents difficult challenges to traditional optical metrology tools due to a higher degree of wafer warpage, smaller RDL critical dimensions, and lower reflectivity of epoxy mold compound (EMC). In this presentation, we will describe a new, patented optical metrology solution developed by Zeta Instruments that overcomes these challenges and give real-world examples of its effectiveness on FOWLP applications such as 2um RDL profiling and polyimide thickness measurement over black EMC.|
|Jeff Donnelly, COO
San Jose, CA