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NiPdAu Plating Qualification of QFN RF-IC Packages
Keywords: QFN, NiPdAu Plating, RF-IC
BTC (Bottom terminated components) is one class of packages that meets this need of light weight and low cost. These components commonly include, QFN (Quad Flat Pack-No lead), SON (small outline-No lead), LGA (Land Grid Array) and MLF (Micro lead frame) packages whose external connections consist of metalized terminations that form an integral part of the component. Quad Flat Pack No Leads (QFNs) are thermally enhanced plastic packages that use conventional copper leadframes. These leadless components provide an advanced packaging solution that reduces board real estate, with improved electrical and thermal performance over traditional leaded packages. An alternative lead free compatible plating used in industry for components is Nickel/Palladium /Gold.[1].The plating provides a solder able surface for both eutectic and lead-free solders , is less amenable to oxidation and provides long term storage and stable solderability over time. The paper summarizes the qualification of NiPdGold finish component leads and solderability evaluations using eutectic and lead free solder. The solderability results were also compared to conventional silver plated copper leadframe with tin plated terminations. Visual inspection, X-sectional analysis , SEM/EDX , solderability tests , bond pull and reliability test results for thermal shock and temp./humidity tests including continuous improvement efforts at subcontract locations.
Mumtaz Y. Bora, Sr. Staff Packaging Engineer
Peregrine Semiconductor
San Diego, CA

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