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Hybrid Thermally Conductive and EMI Absorbing Materials
Keywords: Thermal management, EMI, Hybrid materials
As the complexity and component density of microelectronic assemblies has increased in recent years a significant overlap has been identified between the need for materials that manage thermal and electromagnetic challenges. For example, as multiple heat and signal generating components are isolated underneath a single EMI can a material that transfers heat and absorbs electromagnetic energy can be used to prevent crosstalk and improve signal integrity. These hybrid materials can have a variety of compositions and forms, ranging from thin sheets to soft pads to reactive or non-reactive liquid materials. Additionally, the mechanical, thermal, electrical, and electromagnetic properties of these materials depend to a significant degree on their materials of construction. Several different test methods exist to measure the thermal and electromagnetic properties of a material both as fundamental material properties as well as its performance in an application. This presentation will expand on all of these parameters in more detail as well as discussing existing and future trends in hybrid materials development.
John Timmerman,
Chanhassen, MN

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic