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The role of Die Attach Adhesive (DAA) thickness on thermal and luminous performance of LED package
Keywords: clear DAA and white DAA, Opto-thermal coupling in LED package, DAA thickness
Thermal management of Light Emitting Diode(LED) package has always been a technical hotspot for LED product development. Among all the components of LED package, Die Attach Adhesive (DAA) is bottleneck for heat dissipation within LED. Therefore, its thickness should be fully investigated as an important factor to affect thermal and optical performance of LED. First, Finite Element Method (FEM) and LightTools were adopted to numerically study the Opto-thermal coupled effect under different DAA thickness. The results show that with decreased thickness of DAA, there is a peak value in light output. It indicates that the thermal effect on light performance of LED should also be considered in the luminous simulation of LED, instead of conducting luminous and thermal simulation separately. Second, for different types of DAA such as clear DAA and white DAA, with typical thickness of 7.6 and 20 um, we measured the junction temperature of LED using Forward Voltage Method (FVM). It turns out that the LED with white DAA has similar junction temperature with that with clear DAA. This is another proof that LED using white DAA can have a similar or even better performance than that using clear DAA. This topic will be extended to the effect of package thickness on thermal performance of LED in the future.
linjuan huang,
UC-Irvine
irvine, CA
USA


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