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Evaluating and Selecting Metallic and Well-Performing Thermal Interface Materials
Keywords: TIM, Interface selection, Evaluation
Evaluating and selecting well-performing thermal interface materials requires assessment of performance of individual material types over a range of specifications, not simply maximum bulk thermal conductivity. Certain types of applications have more unusual requirements that include operating maximum and/or minimum temperature, durability characteristics for handling and placement, life and reliability under rapid power and thermal cycling in normal operating duty and suitability for operation in vertical mounting orientations without runout or dryout, performance in harsh ambient conditions, and removal and contact characteristics. These specifications are in addition to typical evaluation for performance measured as thermal resistance, compliance and minimum thickness between mating surfaces, end-of-life reliability, and cost. This presentation will assess applications of this nature and the impact on the definition of high performance and well-performing TIM materials under these conditions. The focus therefore will be on the definition, evaluation, and use of graphitic and metallic and other well-performing material types in atypical applications.
Dave Saums, Principal
Amesbury, 01913

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic