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Green Performance Characterization of Electronics Cooling Design Options: from Air through Card Level Hybrid to Direct Two Phase Touch Cooling
Keywords: two phase, hybrid, opex, capex
As many equipment manufacturers move to higher powers, air cooling at the blade-level becomes more of a challenge, and liquid cooling options are often implemented to allow equipment to operate at higher powers. Pumped liquid cooling has been shown to be more efficient than air cooling in terms of thermal resistance and cost of electricity, and operating expense, but not all liquid-cooled methods have the same advantages. This study examines three different liquid cooling approaches to provide a comparison of the advantages and disadvantages of each option. Instead of asking which cooling fluid is best-suited to cool a data center, this research answers the question,
Alexander Yatskov, VP of Engineering
TF&F Inc.
Beverly, MA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic