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Comparison of Three Liquid Cooling Methods for High-Power Processors
Keywords: High-Power Processor Cooling, Liquid cooling, Phase-change
This study compares three different liquid cooling technologies to determine which of the three methods is able to cool the highest power density processor chips. The first method consists of pumping a liquid through a cold plate provided by CoolIT Systems Inc mounted over a 25.4 mm square heat source. The second method is two-phase immersion cooling of the 25.4 mm square heat source in a bath of 3M Novec 649 liquid with a boiling point of 49C. The third method of cooling consists of single-phase immersion cooling of the heat source using mineral oil as the coolant under both natural convection and forced convection cooling conditions. Based on the results from testing the constructed setups, the CoolIT Systems cold plate solution was able to achieve the highest power dissipation and had the lowest thermal resistance. The 2-phase immersion cooling using Novec 649 performed second best and the single-phase mineral oil immersion solution had the lowest performance. This study will present experimental results of the three liquid cooling methods investigated along with the design details of the heat source and the experimental setup used to determine the cooling limits of each of the configurations
Guy R. Wagner, Director
Electronic Cooling Solutions Inc.
Santa Clara, California

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