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Surface Pro 3 Thermal Module Design
Keywords: innovation, integration, thermal module
The pursuit of thinner and lighter mobile devices drives innovation in thermal design, and Surface Pro 3 exemplifies this. Shedding over 100 gf of weight and thinner by 5 mm, Surface Pro 3 boasts a 1.4” larger display with 50% higher resolution, an i7 processor option, and 28% more battery life. Engineering the Surface Pro 3 required daring efforts from all the sub systems, and the thermal module was no exception. The Surface Pro 3 thermal module is 51% lighter and 35% thinner than the Surface Pro 2 thermal module while still providing sufficient thermal performance for the same line of Intel 4th generation Core Processors. Additionally Pro 3 had to accommodate a single blower instead of two, a 50% reduction in heat pipe thickness and a 34% reduction in overall footprint. Achieving such drastic reduction in size and weight required noteworthy integration at the thermal module level resulting in a state of the art, patent pending, super-compact heat exchanger.
Andy Delano, Senior Thermal Engineer
Redmond, WA

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  • ASE
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  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic