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Mitigation of Static Cold Plate Design Employed To Cool A Multichip Module with Highly Non-Uniform Power Distribution
Keywords: Static water-cooled cold pate, Multichip module, Dynamic cold plate
The trend towards higher heat fluxes and non-uniform power distribution continues as we follow Moores law[1] with technology nodes now approaching 10nm. Cooling is always designed for maximum junction temperature and as such it is important to mitigate hot spots. In turn, these hot spots can result in a substantially large temperature difference across the surface of the Multichip module (MCM) which can be detrimental to its performance and reliability. Mock MCM is simulated by heated copper blocks with embedded thermocouples for sensing temperature. By utilizing these readings in the mock MCM an estimation of die temperatures can be established. A liquid cooling test bench is used for performance testing of the static water-cooled cold plate. During experimental testing the mock MCM is subjected to uniform and non-uniform loading. The response and performance of the static water-cooled cold plate can be calculated by comparing pumping power and die temperatures. This involves determining the pumping power of static water-cooled cold plate needed for maintaining device temperatures in operational range for both uniform and non-uniform loading. In summary, in this paper, we will discuss the performance of static cold plates under uniform and non-uniform power conditions and show that the case for non-uniform power shows a significant performance degradation and thus possibly suggesting a dynamic cold plate. Preliminary discussion of the dynamic cold plate will also be presented.
Ruturaj Kokate, Graduate Student
University of Texas at Arlington
Arlington, Texas

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