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Market Drivers for High Temperature Thermal Materials and Systems Requirements
Keywords: Thermal materials, Market Drivers, Harsh
Demand for improved efficiency in energy generation and consumption, electrification of vehicles, and increased use of electronic systems in applications where harsh environmental conditions are encountered, leads to new needs for thermal materials and systems capable of withstanding those harsh temperatures. While not new in military and certain aerospace applications, the concept of high temperature and harsh environmental operation increasingly involves a wider range of temperatures in electronic system design requirements. Higher temperature requirements are now being encountered which previously would have been considered as not appropriate for electronic components and systems. Differing temperature requirements are found across a range of market segments, which will be identified. Impact on specific types of thermal materials and systems will be identified. Implementation of silicon carbide, gallium nitride, and other semiconductor device materials capable of higher temperature alone is not sufficient for successful module and system design. Design for operating environments in the 225-300degC range, shown as an example, requires that all materials within a module or system be capable of reliable operation at that temperature.
David L Saums, Principal
Amesbury, MA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic