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Thin Fine Pitch Flex Substrate for Wearable
Keywords: Fine Pitch, Flex Substrate, Wireless Power Supply
Recently many types of wearable devices are increasing in number with use in healthcare, medical, hobby, industrial and other applications. When some devices are worn by people, gunconsciousnessh is a keyword to their success. As to gunconsciousnessh, there are many efforts for materials of packages and modules, to make the packages and modules smaller, thinner and lighter not to interfere with the ordinary life. From the point of view of substrate manufacturing, using flexible encapsulant materials, a very thin and bendable module with flex substrate for wearable devices were demonstrated. In order to minimize the height of the module, bare die mount with flip chip bonding was done on thin flex substrate and flexible encapsulant was formed over the bare dies and discrete devices, getting good bendability even after curing process. Fine etching technology can realize high density routing to support fine flip chip footprint with fewer wiring layers than other substrate technology. The thin flex substrate with less-than 100um thickness also helps the module to have better bendability. Wearable devices usually require water proof property as well. Ideally terminals of a connector for electric charge should not be exposed outside. Wireless power supply allows the device to get better water proof property by no-terminal structure. Flex-base coil of wireless power supply by fine pitch technology was developed for wearable devices and evaluated. In the presentation the demonstration of flexible module for wearable devices is introduced, and technologies for the module manufacturing and flex-base coil are explained in details.
Hiroyuki Okabe, Deputy Director / Package Materials Production Div.
Shindo Electronics Co., Ltd.
Hitachi-shi, Ibaraki
Japan


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