Here is the abstract you requested from the wear_2015 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Failure Modes of Wearable Electronics|
|Keywords: Failure Modes, Reliability, advanced packaging|
|We tend to be fascinated by the newest technologies to come along in the various electronics markets. The wearables market is no different. We are enamored by the futuristic outfits in Tron to the latest high tech fashion-Google glass. What are the requirements of a typical wearable electronics device? They must be non-restrictive, portable, always be accessible, easily controllable, and have both localized communication and possibly wireless communications capabilities. The soldier systems must be much more robust and be able to withstand rain, sand and dust, thermal shock, solar radiation (UV exposure), icing, high and low temperatures, fungus growth, water immersion, mechanical shock and electromagnetic (EMC) compatibility. As such, these systems are costly and have long development cycles. The commercial industry for wearables does not design for these environments due to cost constraints and life expectancies of the products. But does that gibe with the consumer’s expectations? Doubtful. Understanding the various issues that could impact wearable electronics from a reliability perspective is necessary for the consumer and the manufacturer to achieve a common set of objectives. This presentation will provide insight into the environments and issues that can specifically impact wearable electronics and provide guidance on methodologies for assuring reliability.|
|Greg Caswell, Sr. Member of the Technical Staff