Here is the abstract you requested from the wear_2015 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Low profile 3D Silicon substrate technology for Medical implants|
|Keywords: 3D integration , Silicon, medical|
|Innovation is “Must” in Implantable Device and Component Technology, IPDiA , as a center of excellence is closely involved with the key players of Medical devices adopting new implantable electrical stimulation technologies for brain , spine or pacing systems , cardioverter defibrillators, or cardiac resynchronization therapy pacemakers and defibrillators , to improve the products performance. The 3D Silicon substrate technology of IPDiA, based upon monolithic Silicon combined with advanced 3D topology, provides smaller devices, low profile and innovative device shapes, with very low DC leakage current and high reliability as an outstanding alternative to TA/MLCC capacitors . This presentation will concentrate on the technology and the failure modes in order to give a better understanding of the performances, illustrated by several examples of realization of 3D heterogeneous stacks.|
|Catherine Bunel, R&D Director