Micross

Abstract Preview

Here is the abstract you requested from the wear_2015 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

The Tip of the Iceberg: The Opportunity for Smart Textiles
Keywords: Smart Textiles, Wearable, Sensing
The history of computing is marked by major shifts that occur when miniaturization allows new, significantly smaller devices. At each shift the market for these devices grew enormously. Today, computing and sensing are moving from devices to textiles and apparel. This move from the hard environment of a wearable or smartphone to the soft environment of a shirt or jacket presents fantastic opportunities and formidable challenges. In this talk we will explore the various ways connectivity and sensing are approached in these applications.
Nicholas Langston,
TE Connectivity
,
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems