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Additive Manufacturing of RF and Power Systems
Keywords: additive manufacturing, RF, Power Systems
SI2 Technologies, Inc., has developed direct-write capabilities for additive manufacturing of two-dimensional and three-dimensional structures. These capabilities include the ability to print on flexible and rigid substrates, to work with non-planar objects, and to print both conductive and non-conductive material. By eliminating the requirement for product-specific tooling, these capabilities enable mixing of low-volume, high-complexity designs such as circuits for munitions and soldier radios together with high-volume, low-complexity designs such as wearable electronics into the same manufacturing flow. Applications of these capabilities to antennas, frequency-control surfaces, and flexible ultracapacitors will be discussed to document how additive manufacturing expands the potential for each.
Dr. Jonathan Dixon,
SI2 Technologies, Inc.
North Billerica, MA

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