Micross

Abstract Preview

Here is the abstract you requested from the Additive_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Additive Manufacturing of RF and Power Systems
Keywords: additive manufacturing, RF, Power Systems
SI2 Technologies, Inc., has developed direct-write capabilities for additive manufacturing of two-dimensional and three-dimensional structures. These capabilities include the ability to print on flexible and rigid substrates, to work with non-planar objects, and to print both conductive and non-conductive material. By eliminating the requirement for product-specific tooling, these capabilities enable mixing of low-volume, high-complexity designs such as circuits for munitions and soldier radios together with high-volume, low-complexity designs such as wearable electronics into the same manufacturing flow. Applications of these capabilities to antennas, frequency-control surfaces, and flexible ultracapacitors will be discussed to document how additive manufacturing expands the potential for each.
Dr. Jonathan Dixon,
SI2 Technologies, Inc.
North Billerica, MA
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems