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Direct-Write Printing Methods for the Fabrication of Printed Hybrid Electronics
Keywords: Direct-Write Printing, Fabrication , Printed Hybrid Electronics
Direct-write printing methods have been used to fabricate multi-layer circuits that have been shown to perform on par with standard PC boards. These additively manufactured circuits still have surface mounted components and contain materials that need to be processed at temperatures in the range of 250C. New materials sets are being developed that can be processed at temperatures at or below 150C. Additionally, fabrication procedures are being developed such that the electrical components can be embedded/integrated into the fabrication of the circuits. Additive manufacturing methods for the fabrication of power supply and digital interface circuits will be presented and discussed in detail. A redesign of these circuits will be discussed in an effort to progress beyond surface mounted components by developing methods for embedding/integrating the electrical component directly into the fabrication of the circuitry.
Dan Hines,
Laboratory for Physical Sciences
, MD

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic