Here is the abstract you requested from the Additive_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Digital 3D Printing Processes for the Fabrication of Flexible Wearable Electronics at ARL|
|Keywords: 3D Printing, Flexible Electronics, Wearable Applications|
|The objective of the Flexible Electronics team at ARL is to develop low-cost electronics integrated in 3D structures to enable wearable, intelligent garments with integrated distributed sensors, power and data processing. Our additional responsibilities include supporting Expeditionary and Adaptive technology fabrication which are deployable and threat responsive. Additive manufacturing processes, such as filament direct-write and FFF, have been used to fabricate multi-layer circuits that have been shown to perform on par with standard PC boards. Common conductive pastes are usually processed in the range of 250°C, while common FFF materials are usually structurally compromised at around 80°C. Resulting in expensive FFF materials choices or partially cured conductive materials. These inherent 3D printing electrical losses and solutions will be discussed. Additional integrated printing processes will be presented to minimize these losses. Specifically, laser ablation and photonic scintering attachment options on the nScrypt tool.|