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Digital 3D Printing Processes for the Fabrication of Flexible Wearable Electronics at ARL
Keywords: 3D Printing, Flexible Electronics, Wearable Applications
The objective of the Flexible Electronics team at ARL is to develop low-cost electronics integrated in 3D structures to enable wearable, intelligent garments with integrated distributed sensors, power and data processing. Our additional responsibilities include supporting Expeditionary and Adaptive technology fabrication which are deployable and threat responsive. Additive manufacturing processes, such as filament direct-write and FFF, have been used to fabricate multi-layer circuits that have been shown to perform on par with standard PC boards. Common conductive pastes are usually processed in the range of 250°C, while common FFF materials are usually structurally compromised at around 80°C. Resulting in expensive FFF materials choices or partially cured conductive materials. These inherent 3D printing electrical losses and solutions will be discussed. Additional integrated printing processes will be presented to minimize these losses. Specifically, laser ablation and photonic scintering attachment options on the nScrypt tool.
Harvey Tsang,

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic