Abstract Preview

Here is the abstract you requested from the ASP_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Advanced Die Attach Materials for High Power Applications
Keywords: sintered silver, thermal conductivity, solder replacement
High power semiconductor applications such as RF and microwave applications, GaN and SiC power devices and High Brightness LEDs, (HBLED) require a die attach material with high thermal conductivity to efficiently release the heat generated from these devices. In these type of applications, the main path for heat dissipation is from the device through the die attach material. In order to provide an effective thermal path, it is important for the die attach material to maintain good interfacial contact with backside of the die and substrate. In addition to meeting the necessary thermal performance, die attach materials are required to offer high reliability, ready for high volume manufacturing (HVM) and readily available while meeting RoHS compliance and offering an economical solution. Current die attached solutions such as eutectic solders such as AuSn and lead (Pb) solders have been an industry standards offering good reliability and effective thermal conductivity however both options have their drawbacks. AuSn has set the benchmark for thermal performance but high material cost and complex processing requiring high processing temperature (greater than 280⁰C), pressure during cure and heated substrate minimize the flexibility in package design. Pb based solders offer a more economical solution with lower processing temperatures and higher ducility but are not environmentally friendly and do not meet RoHS regulations. High thermal conductive silver epoxies have provided an attractive alternative to solders offering lower processing temperatures, RoHS complaint and faster throughputs however they cannot match the thermal performance of AuSn solders due to lower interfacial contact. The interfacial connection for these materials is through the epoxy resin which increases the thermal resistance and impacts package performance. Recent developments in sintered silver die attach pastes offer the latest solutions to replacing solders in the semiconductor market providing a RoHS complaint material with unmatched thermal performance and high reliability. Furthermore, these materials are ready for high volume manufacturing using standard equipment with no special requirements and low processing temperatures. This presentation will compare the current die attach solutions with the latest developments in sintered silver technology for meeting the requirements for high power semiconductor applications with focus on pressureless, low temperature sintering technology and resin reinforcement for high reliability.
Ken Araujo, Regional Manager
NAMICS Technologies, Inc.
Acushnet, MA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic