Here is the abstract you requested from the ASP_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Glass Substrates for Electronics Applications|
|Keywords: Glass, Electronics, Packaging|
|Glass has inherent benefits valuable to electronics packaging such as cleanliness, flatness, surface quality, optical transmission, hermeticity, and thermal and dimensional stability (to name a few). This presentation provides an overview of glass substrates and how they enable high quality electronic devices with specific focus on demonstrations of 2.5/3D and R2R thin (<200um) glass.|
|Scott C. Pollard, Research Manager