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Glass Substrates for Electronics Applications
Keywords: Glass, Electronics, Packaging
Glass has inherent benefits valuable to electronics packaging such as cleanliness, flatness, surface quality, optical transmission, hermeticity, and thermal and dimensional stability (to name a few). This presentation provides an overview of glass substrates and how they enable high quality electronic devices with specific focus on demonstrations of 2.5/3D and R2R thin (<200um) glass.
Scott C. Pollard, Research Manager
Corning Incorporated
Corning, NY

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic