Here is the abstract you requested from the ASP_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Meeting Solder Paste Printing Challenges for SiP in “Smart” IoT Devices|
|Keywords: SiP, Solder paste, Printing|
|System in package (SiP) is an increasingly important package type that comprises a variety of different package assembly materials and processes that minimizes volume, without sacrificing computational intensity. This market is, of course, driven by the smart, mobile “internet of things” (IoT) devices, such as smartphones and smartwatches. Solder deposition techniques are also changing. This paper will discuss ultrafine-pitch solder paste printing to meet the needs of SiP mobile devices, with a focus on attachment of 01005 and 008004 passive devices.|