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Meeting Solder Paste Printing Challenges for SiP in “Smart” IoT Devices
Keywords: SiP, Solder paste, Printing
System in package (SiP) is an increasingly important package type that comprises a variety of different package assembly materials and processes that minimizes volume, without sacrificing computational intensity. This market is, of course, driven by the smart, mobile “internet of things” (IoT) devices, such as smartphones and smartwatches. Solder deposition techniques are also changing. This paper will discuss ultrafine-pitch solder paste printing to meet the needs of SiP mobile devices, with a focus on attachment of 01005 and 008004 passive devices.
Maria Durham,
Indium Corporation
Clinton, NY
USA


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