Here is the abstract you requested from the ASP_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Inside the Black Box - Assembly Reflow as the Unseen Threat to Electronic Package Reliability|
|Keywords: Assembly Reflow, Package Reliability, Manufacturing|
|As arguably the most important process in electronic manufacturing, assembly reflow enables all levels of electronic packaging by joining together chips, substrates, components, and/or circuit boards into a functioning device or product. Depending on the number and complexity of components involved, a final shipped product may be the composite of hundreds of individual reflows representing numerous different parts and materials, solder alloys, temperature profiles, types of reflow ovens, part fixturing and orientation options, and incoming component quality levels. In fact the only two elements common to all reflows may be: 1) Reflow is the most extreme temperature cycle that most components will experience in their functional life, with potential for catastrophically high levels of stress, 2) Reflow is a|
|Kevin Knadle, Principal Engineer