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|Deformation and Consolidation of Alumina Particles - Basis for Aerosol Deposition, a Room Temperature, Solid-State Deposition Process|
|Keywords: Aerosol Deposition, Alumina, Molecular Dynamics Simulation|
|Ceramics often exhibit very little plastic deformation before brittle fracture, limiting applications. A process to fabricate ceramic films at room temperature (RT) in solid-state, aerosol deposition (AD), has been pioneered and demonstrated by J. Akedo and his colleagues since the early 2000’s. High velocity ceramic particles, impact on substrates, deform, and form films under vacuum. AD eliminates high processing temperatures, enables materials integration, where ceramics are deposited on metals, plastics, and glass at RT. The fundamental mechanisms for ceramic particle deformation/bonding in AD are not well understood. We utilized atomistic simulations and transmission electron microscopy (TEM) to study deformation behavior and consolidation of alumina particles in AD films. In our previous work, atomistic simulations of compressed 10 nm alumina particles and in situ micro-compression in the TEM of 300 nm alumina particles showed that dislocation plasticity preceded fracture. Moreover, direct observation of dislocation nucleation and movement within the particles was recorded. In this work, we investigate alumina particle consolidation in AD films by performing atomistic simulations of alumina particle impacting on alumina substrate and thorough characterization of AD alumina films. B.L. Boyce, K. Hattar, and D.C. Bufford were supported by the Department of Energy (DOE) office of Basic Energy Sciences, Materials Science and Engineering. This work was performed, in part, at the Center for Integrated Nanotechnologies (CINT), an Office of Science User Facility operated for the U.S. DOE Office of Science. This work is supported by the Laboratory Directed Research and Development program at Sandia National Laboratories, a multi-program laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Corporation, for the U.S. DOE's National Nuclear Security Administration under contract DE-AC04-94AL85000.|
Sandia National Laboratories