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Novel Dielectric Materials for Passive Integration and Electronic Packaging Applications
Keywords: dielectric, LTCC, packaging
With the rapid development of wireless hand-held devices, the needs for passive component devices working in microwave range with enhanced reliability, miniaturization and electrical performance are increasing fast. Low temperature cofiring ceramic (LTCC) provides one of good solutions for integrating the passive components as a functional module for microwave applications. Novel dielectric ceramics with the sintering temperature lower to 460C to 600C have been systematically investigated. The mechanism of microwave dielectric response was studied and the contribution of intrinsic and extrinsic dielectric loss was revealed. Ion substitutions as well as the biphase composites were used to tailor the dielectric properties effectively. Prototype LTCC devices have been demonstrated. Second, polymer-based nanocomposites for electronic packaging applications have been systematically investigated with the aim to shoot the technical problems of composite materials with low thermal conductivity, and break the limitations of traditional preparation methods. With the introduction of high thermal conductivity fillers in combination of filler surface modification, composite structure type tailoring and filler-matrix interface controlling, the thermal and electric properties of obtained polymer-based nanocomposites have been significantly improved to meet the requirements of electronic packaging materials with the optimal combination of high thermal conductivity, low dielectric constant and loss.
Hong Wang, Professor
Xi'an Jiaotong University
Xi'an, 710049

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic