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Enabling 2um line space panel or wafer based Lithography and Inspection
Keywords: Lithography, Inspection, Fan-out WLP
Industry is pushing for 2um line space and line width Re-Distribution Layer based Fan-out. The plan is to implement on either 300 or greater wafers or large sized panels. The paper presents challenges that have to be overcome to expose fine-pitched RDL on panel and wafers and the results of the lithography process. In addition, substrates may be organic and even on Epoxy molded compound approach, there are organic material related defects that are very hard to detect using standard bright-field or dark-field. The paper presents a novel fluorescent image based high speed defect detection system and the results and capabilities of detecting defects on panels”
Keith Best, Director Applications
Rudolph Technologies
Wilmington, MA

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  • Technic