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On the Way from Fan-out Wafer to Fan-out Panel Level Packaging
Keywords: Fan-Out, FO-WLP, Panel Level Packaging
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. The technology has a high potential in significant package miniaturization concerning package volume but also in thickness. Main advantages of FOWLP are the substrate-less package, lower thermal resistance, higher performance due to shorter interconnects together with direct IC connection by thin film metallization instead of wire bonds or flip chip bumps and lower parasitic effects. Especially the inductance of the FOWLP is much lower compared to FC-BGA packages. In addition the redistribution layer can also provide embedded passives (R, L, C) as well as antenna structures using a multi-layer structure. It can be used for multi-chip packages for System in Package (SiP) and heterogeneous integration. Manufacturing is currently done on wafer level up to 12
Tanja Braun,
Fraunhofer IZM
, D

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