Here is the abstract you requested from the CPI_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|FO-WLP: A Disruptive Technology|
|Keywords: FO-WLP, Fan-Out, Wafer Level CSP|
|Fan-out WLP (FO-WLP) as a new form of wafer level CSP represents a disruptive technology that has a major implications semiconductor packaging and assembly infrastructure. FO-WLP is expected to be use for a number of applications in a variety of markets. FO-WLP is disruptive technology because there is no substrate and thin-film metallization is used for interconnect instead of bumps or wires. This presentation examines the drivers for FO-WLP, various formats, and the impact on the existing infrastructure. Applications and market trends are presented.|
|E. Jan Vardaman,
TechSearch International, Inc.