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FO-WLP: A Disruptive Technology
Keywords: FO-WLP, Fan-Out, Wafer Level CSP
Fan-out WLP (FO-WLP) as a new form of wafer level CSP represents a disruptive technology that has a major implications semiconductor packaging and assembly infrastructure. FO-WLP is expected to be use for a number of applications in a variety of markets. FO-WLP is disruptive technology because there is no substrate and thin-film metallization is used for interconnect instead of bumps or wires. This presentation examines the drivers for FO-WLP, various formats, and the impact on the existing infrastructure. Applications and market trends are presented.
E. Jan Vardaman,
TechSearch International, Inc.
Austin, TX
USA


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