Here is the abstract you requested from the CPI_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Interaction of active dies, passives, sensors and already packaged components in WLFO based WLSiP and WL3D packages|
|Keywords: FOWLP, EWLB, IoT|
|The package is the transformer between silicon die and external world with respect to electrical interconnection, mechanical interfaces, and space. It is closing the gap between die pad pitch and landing pad pitch on the printed wiring board. In fulfillment of this function, WLFO has several advantages compared to FlipChip packaging solutions, namely lower stress on the die pads, and smaller pad sizes and pitches. WLFO is a flexible packaging technology platform allowing heterogeneous high density integration of multiple active dies, passives, sensors and even already packaged components on little space and, due to the fact that it is substrate-less technology, at lowest package height achieved in the industry today. The thin-film processes and materials applied need to be understood, and their interaction with the different parts inside the package needs to be optimized for the reliability level required by the respective application. This workshop presentation will discuss some of the relevant experiences made by NANIUM during the development of WLFO based WLSiP and WL3D in the last few years.|