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|V-DOE Full Cut Dicing of Thin Si IC Wafers|
|Keywords: Laser, Dicing, Die strength|
|The ongoing trend to thinner wafers which are needed for continuous miniaturization, 3D packaging and IC performance, inevitably means that sole blade dicing evolution is coming to an end. Over the last years several technologies to handle the separation process of thin Si wafer dicing have been evaluated (DBG, Stealth, Plasma, etc). Although they are capable for certain applications to meet the process specifications, they achieve this at expense of flexibility, productivity and process costs. ALSI has developed a technology using a multi beam laser concept which allows to dice through thin Si IC wafers while achieving a die strength equal or higher than achieved with blade dicing. In this single step process a multi beam laser configuration separates through low-K and metal top structures, through the Si substrate and DAF while achieving a die strength equal or higher than a blade process (>450MPa for a 70um Si wafer). This technology allows the semiconductor industry to continue with the development of thinner wafer technology utilizing (ultra) low-K and thick metal structures while having a separation technology that can cope with all these process steps. The paper addresses how multi beam laser dicing is an enabling technology and the first process in the world that can meet the die strength criteria without the need of additional process steps which otherwise will increase the cost and reduce the flexibility and yield of the process. Multi beam laser dicing allows semiconductor manufacturers to execute their technology roadmap in a cost efficient manner. We will present the die strength and quality that has been achieved using the multi beam dicing technology and compare this to other separation technologies. It will be demonstrated how a unique combination and optimization of multiple beams, pulse duration, and low pulse energy, can meet the challenging requirements set by the industry. In addition dicing results and achieved productivities will be presented.|
|Jeroen van Borkulo, Product Manager
ASM Pacific Technology