Micross

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Enabling next generation M-WLCSP through Laser dicing
Keywords: EMC, Laser, Dicing
Using ASM PT's patented multi beam technology a laser full cut process is obtained for a 350m thick over molded WLCSP wafer. In this study various EMC materials and filler sizes have been evaluated and results will be reported. A dicing width of 12 m was achieved with a productivity a factor 2 higher compared to conventional dicing technologies and a CoO 1.5 times lower. In the paper more details and info will be provided on the results in the new laser dicing application.
Jeroen van Borkulo, Product Manager
ASM Pacific Technology
Phoenix, AZ
USA


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