Here is the abstract you requested from the dpc_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Enabling next generation M-WLCSP through Laser dicing|
|Keywords: EMC, Laser, Dicing|
|Using ASM PT's patented multi beam technology a laser full cut process is obtained for a 350µm thick over molded WLCSP wafer. In this study various EMC materials and filler sizes have been evaluated and results will be reported. A dicing width of 12 µm was achieved with a productivity a factor 2 higher compared to conventional dicing technologies and a CoO 1.5 times lower. In the paper more details and info will be provided on the results in the new laser dicing application.|
|Jeroen van Borkulo, Product Manager
ASM Pacific Technology