Here is the abstract you requested from the dpc_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Applocaation of mathematical modeling to thermo - compression flip chip bonding of copper micro pillar bumps for 3d die stacking|
|Keywords: Thermocompression Flip Chip , process optimization, mathematical modeling|
|Thermo-compression flip chip bonding of Sn-capped Cu-micro pillar bumps is an important option for die to die stacking. As this bonding operation has to be used several times for a multi die stack, the Cycle time for this process step is important to productivity and process cost. Optimizing the process parameters for best yield and reliability is normally performed experimentally on existing bonding equipment. To develop new process & equipment, specifically the thermo - compression bonding head, it is preferable to simulate bonding performance of various designs a priori, so development time too can be cut. The bonding process is complex as it involves the melting of the Sn cap, formation & growth of the intermetalic layer, development of the final bond geometry, all of which affect the yield, reliability etc. Unsteady state heat transfer modeling of the bonding process was developed various bond profiles were simulated and correlated with actual bond microstructures. This model suggests that a counter - intuitive conclusion i,e. short bonding time may actually produce more reliable bonds. This has implications on fast bonding tools under development. Key modeling, characterization & bonding methods and results will be discussed.|
|Dev Gupta, CTO