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High Temperature Potting Materials for Wire Bond Encapsulation
Keywords: high temperature potting, high temperature electronics, reliability
Test results for a range of potting materials for encapsulation of wire bonds for a high temperature multi-chip module is presented. The potting materials include gels and more rigid epoxies, silicone, and silicone-ceramic materials. The materials were initially screened based on ease of processing, cracking, and weight loss at 200, 225, and 250C. Materials that performed well after this initial screening were tested for insulation resistance at 200, 225, and 250C and wire bonds were encapsulated for thermal cycled at -55 to 200C and -55 to 250C.
David Shaddock, Electronics Packaging Engineer
General Electric Global Research
Niskayuna, New York
USA


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