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Comparative Modeling and Analysis of Lead-free Solder Extrusion for the Design of Reliability
Keywords: lead free, design of experiments, surface mount devices
Due to rapid growth of the microelectronics industry, the packaged device with small form factor, low cost, high power performance, and increased efficiency has become a high demand in the market. To realize the current market development trend, flip chip interconnection and System-in-Package (SiP) are some of the promising packaging solutions developed. However, a surprising amount of surface mount technology (SMT) defects are associated with the use of lead-free solder paste and methods by which the paste is applied. By understanding different handling methods, lead-free SMT soldering defects can be reduced or subsequently eliminated, and understood at the level of the mathematical modeling and analysis. This paper will examine the effects of the solder extrusion when applied in two different types of lead-free solders, Sn-Ag-Cu (SAC) and BiAgX. The systematic investigation will include the comprehensive failure analysis on the surface mount devices (SMD) and compare the modeling and analysis of the two different solder types utilizing the design of experiments methods.
Youngtak Lee, Microelectronic Packaging Engineer
Starkey Laboratories
Eden Prairie, MN

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