Here is the abstract you requested from the IMAPS_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Effect of Temperature/Humidity Treatment on Interfacial Reliability on Screen-Printed Ag / Polyimide for Advanced Embedded Packaging Technologies|
|Keywords: Interfacial Reliability , screen printing, embedded packging|
|Future flexible electronic devices have increasingly expected to require fabrication technology of micro-scale active or passive components on flexible organic substrate for advanced embedded packaging technologies. Polyimide has properties of flexible, high temperature resistance, good mechanical strength, good chemical stability, and low dielectric constant. Therefore metal thin film/polyimide structure systems are commonly used as printed patterned flexible circuit. Therefore, polyimide, as a flexible substrate, has been investigated for the development of low-cost flexible electronic systems. Silver is one of the best conductor in electronic systems, but during silver metallization on polyimide substrate, silver/polyimide structure has poor interfacial adhesion. Also there is the other largest problem during developing this technology, which is long-term interfacial adhesion and reliability. Therefore, in this study, in order to understand the effect of annealing and temperature/humidity treatments on the interfacial adhesion energy between screen-printed Ag film and polyimide substrate structure were evaluated by 180° peel test. The temperature/humidity treatment was performed at 85℃/85% relative humidity for 1000hrs as an acceleration test to simulate a long-term reliability. The annealing treatment was carried out at 200℃. The measured peel strength values were decreasing after annealing and temperature/humidity treatments. The major reliability concerns of the metal/polyimide systems are the degradation of the interface adhesion after annealing and temperature/humidity treatments. In order to understand the interfacial adhesion mechanism of screen-printed Ag on polyimide after annealing and temperature/humidity treatments, the peeled surfaces of metal and polyimide substrate are analyzed by X-ray photoemission spectroscopy. Additionally, the relationships among microstructure, electrical properties, and interfacial adhesion energy were evaluated and discussed systematically.|
|Kyu Hwan Lee, Principal Researcher
Korea Instittue of Materials Science
Rep. of Korea