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Optimization of Processing Condition for Isotropic Conductive Paste using Cu and Solder Powder
Keywords: isotropic conductive paste, Ag coated Cu, flip-chip bonding
An isotropic conductive paste (ICP) composed of Ag coated Cu and Sn/Ag/Cu solder and thermosetting resin was developed. The thermosetting resin was designed to be able to remove oxide on the surface of metal filler. For the thermal analysis of ICP, differential scanning calorimeter (DSC) and thermogravimetric analyzer (TGA) were conducted, and volumetric resistance and shear strength were also measured to evaluate the electrical and mechanical performances, respectively. In order to reduce void content of ICP between a substrate and a silicon device, a vacuum process at 150oC for 2minutes was used before flip-chip bonding process. After flip-chip bonding process, the void content was measured by X-ray. The flip-chip bonding pressure was also optimized to minimize void content after the bonding process. During bonding process, the generation of void in ICP was visually observed under the given thermal cycle. The measured volume resistivity, void content and shear strength were 140Ω-cm, 1.22% and 4.9MPa, respectively.
Yong-Sung EOM, Principal Researcher
Electronics and Telecommunications research Institute
Daejeon, Yuseong-gu
South Korea

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