Here is the abstract you requested from the IMAPS_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Optimization of Processing Condition for Isotropic Conductive Paste using Cu and Solder Powder|
|Keywords: isotropic conductive paste, Ag coated Cu, flip-chip bonding|
|An isotropic conductive paste (ICP) composed of Ag coated Cu and Sn/Ag/Cu solder and thermosetting resin was developed. The thermosetting resin was designed to be able to remove oxide on the surface of metal filler. For the thermal analysis of ICP, differential scanning calorimeter (DSC) and thermogravimetric analyzer (TGA) were conducted, and volumetric resistance and shear strength were also measured to evaluate the electrical and mechanical performances, respectively. In order to reduce void content of ICP between a substrate and a silicon device, a vacuum process at 150oC for 2minutes was used before flip-chip bonding process. After flip-chip bonding process, the void content was measured by X-ray. The flip-chip bonding pressure was also optimized to minimize void content after the bonding process. During bonding process, the generation of void in ICP was visually observed under the given thermal cycle. The measured volume resistivity, void content and shear strength were 140Ω-cm, 1.22% and 4.9MPa, respectively.|
|Yong-Sung EOM, Principal Researcher
Electronics and Telecommunications research Institute