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Wedge Bonding Wire and Ribbon to Support RF and Optoelectronic Packaging
Keywords: RF Packaging, Ribbon Bonding, Wedge Bonding
The proliferation mobile devices, video on demand-mobile and home, and Internet of things, continues to drive an exponential grow in data bandwidth. To meet the data demand requires continuous improvements in bandwidth and capacity for RF base stations modules and optoelectronic modules. RF and Optoelectronic modules have many similar wire bond packaging requirements, especially as optoelectronic data rates continue to increase from 10G through 400G. This paper will provide a survey of the RF and Optoelectronic Packages and the common wire and ribbon bond requirements. The paper will also survey the packaging challenges and solutions available to process engineers. Challenges include bonding on a variety of materials, signal pins, RF loop spans and shapes for wire and ribbon, program strategies to maintain constant loop span, referencing challenges, and simplified machine user interactions. The paper will also discuss collaborations between manufacturer and equipment supplier with helpful tips leveraging each others strengths to transition from concept to production.
Daniel Evans, CTO
Palomar Technologies
Carlsbad, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic