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High Speed Fluorescent Inspection for Organic defects
Keywords: Fluorescent Inspection, Organic defects, Non-visible defects
The semiconductor industry continues to drive down defectivity rates, especially as the liability to ship replacement parts for field failures is pushed back into the supply chain. Inspection using white light, for advanced packaging is well known, and as dimensions are driven down to finer pitch, considered mandatory. There are a certain class of defects that are caused by organic residue. These appear transparent to white light but can be the root cause of field reliability issues. Residue on top of bump, as an example, could cause damage to the part when operating at high temperatures in the field. Up until now, such an inspection would have been performed either using a manual fluorescent microscope or not at all. A well understood capability gap in the industry, defects due to organic residue are present in Copper pillar bump and wafer level chip scale packages both fan-in and fan-out, as well as packages based on organic substrate. This paper presents data from high-speed fluorescent inspection that could address this problem in a unique way that was not possible up until now.
Gurvinder Singh, Product Marketing Manager
Rudolph Technologies
Bloominton, MN

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