Here is the abstract you requested from the IMAPS_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Optical Role of Die Bonding for Chip-on-Board White Light Emitting Diode Emitters|
|Keywords: Light emitting diodes, Backside chip reflector, Die attach adhesive|
|The role of die attach adhesive in influencing light output of the white chip-on-board (COB) light emitting diode (LED) emitters is investigated using Monte-Carlo simulations. It is demonstrated for the first time that the use of an optically clear adhesive for replacing conventional adhesive for multiple COB white LED emitters leads to a significant enhancement in light output of up to 22 %. An optimization of packaging materials and process for multiple COB LED emitter to enhance optical efficiency is also studied.|
University of California, Irvine