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Optical Role of Die Bonding for Chip-on-Board White Light Emitting Diode Emitters
Keywords: Light emitting diodes, Backside chip reflector, Die attach adhesive
The role of die attach adhesive in influencing light output of the white chip-on-board (COB) light emitting diode (LED) emitters is investigated using Monte-Carlo simulations. It is demonstrated for the first time that the use of an optically clear adhesive for replacing conventional adhesive for multiple COB white LED emitters leads to a significant enhancement in light output of up to 22 %. An optimization of packaging materials and process for multiple COB LED emitter to enhance optical efficiency is also studied.
Gunwoo Kim,
University of California, Irvine
Irvine, CA
USA


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