Here is the abstract you requested from the IMAPS_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Additive Printing of Tight Tolerance Embedded Components via High Precision Shadow Masking and Their Integration with Traditional Circuit Board Manufacturing|
|Keywords: Additive Manufacturing of Electronics, Thin Film Electronics, Embedded Passive and active devices|
|Most embedded components manufactured today are made either by photolithography to pattern inner layer materials or by placing discrete components on an inner layer and subsequent planarization with a potting compound. These traditional methods produce devices with poor tolerance due to inherent variances in the photolithography and etch process, parasitic capacitance of long traces. Discrete embedded components increase thickness and weight and suffer from reduced reliability caused by the planarization process. In this paper, we will discuss an alternative patterning method to integrate inline embedded passive and active components without photolithography processing. This additive printing process uses high precision, high feature density shadow masks combined with micrometer level registration. Devices are built layer by layer using off-the-shelf, bulk materials (no inks) that produce tight tolerance passive and active components that can be integrated into traditional PCB and wafer-level processing. Examples of such devices for both DC and RF applications and preliminary test data will be presented in this paper.|
|Scott Lauer, VP Business Development