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Achieving Low Voiding with Lead Free Solder Paste for Power Devices
Keywords: solder paste, low voiding, SnAg lead free
Achieving Low Voiding with Lead Free Solder Paste for Power Devices For Submittal to IMAPS 2016 Pasadena Authors: Pierino I Zappella, Saeed Sedehi, Alex Voronel, Bruce Wilson SST International, Downey Ca 90242 Abstract Objective: (1) To demonstrate very low voiding (under 5 % void area) with solder paste on different materials such as Nickel to Nickel, Copper to Copper, Nickel to Copper, and with Silicon die to Nickel and Silicon die to Copper. (2) To achieve a short cycle time for the solder paste reflow operation. Flux in solder paste is a major contributor to voiding. Our approach is to utilize different pressure settings to reduce the voiding to a higher production acceptance level. Test coupons of pure nickel and copper will be sized for simulated die and substrates. Silicon device die will also be included. A lead free 95Sn5Ag alloy water soluble solder paste has been selected for this evaluation. Paste application will consist of manually screen print with templates of different thicknesses. Void Detection levels to be identified primarily by an in house X RAY system. The advantages of solder paste are quite significant, but high voiding can result from the flux incorporated in the paste. We have evaluated a low voiding flux solder paste compatible with power device metal materials and lendable to production implementation.
Pierino I Zappella,
SST International
Downey, CA

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