Micross

Abstract Preview

Here is the abstract you requested from the IMAPS_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

iNEMI Connector Reliability Test Recommendations Project Report
Keywords: Connector, Reliability, Testing
A key issue identified by the 2013 iNEMI connector survey was that test capabilities for socket reliability (such as temp cycle and shock, failure analysis) are different across the various socket/connector manufacturers. The associated criterion for ‘passing’ is not consistent. One of the interests shown from the survey was in the topic of Standard Reliability Qualification, the need to drive standard reliability test conditions and equipment capabilities across the industry. To this end, the iNEMI Connector Reliability Test Recommendations project group reviewed current classes of connectors and identify gaps, which proved input for the development of an industry survey as to determine a current list of levels used by suppliers/OEMs, leading to the development of a connector standard list levels for each package levels connector type. The work presented here defines levels for each packaging class of connector. In addition, to a proposed associated test conditions of one class and associated Pass/Fail criteria.
Vincent Pasucci, Sr. Principal Engineer Mgr. Harrisburg Failure Analysis and Reliability Lab
TE Connectivity
Harrisburg, PA
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems