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High temperature comparisons between transient liquid phase sintering materials and conventional solders.
Keywords: High Temperature, Pb Free, Interconnect
Components and materials used in electronics for under-the-hood automotive, down-hole oil and gas exploration, and aerospace are being subjected to higher temperature applications. There is also a trend to move to over-molded packages to replace pre-molded packages in order to reduce module cost and final package size. As new higher temperature over-molding materials have been introduced, the in-mold temperatures that the components must withstand have increased from 250°C to 350°C over the last few years. The melting points of Pb and Sb based solders are being reached or exceeded as electronic assemblies are being used in higher temperature applications or being over-molded with new higher temperature capable molding materials. The re-melting of a solder joint after the initial assembly process is a major concern because the reflowed solder joint may result in an electrical failure, either a short or open or worse a weakened joint that may lead to a reliability issue as a field failure during operation. The electronics industry views reflowed solder joints as an unacceptable practice due to potential electrical failures that can result from a reflowed joint. KEMET has developed a technology known as Transient Liquid Phase Sintering (TLPS) for use as a high temperature lead attach material for capacitors for high temperature applications. The significant advantages of TLPS technology is that it is both Pb and Sb free, has a relatively low initial processing temperature <300°C, and a high temperature capability (>400°C). Initial reliability testing shows that this technology meets or exceeds automotive reliability testing requirements for leaded components. However, there is little performance data that shows a direct comparison of TLPS technology to existing Pb based or Pb free solders. This paper will compare the high temperature mechanical performance of solders, previously presented in HiTEC 2014 to high temperature lead (Pb & Sb) free CuSn and InAg TLPS. These TLPS materials have processing temperatures of <300°C with melting points (>400°C). Their performance ≥ 200°C are compared to 10Sn/88Pb/2Ag, 93.5Pb/5Sn/1.5Ag, 91.5 Sn/8.5Sb, and SAC 305 solders. This study provides some valuable insight on the viability of utilizing TLPS technology as a high temperature Pb free and Sb-free interconnect material for use in high temperature applications as compared to the industry standard bearers of Pb based solders and Pb free solders.
John E. McConnell, Technical Director Advanced Product and Material Development
KEMET Corporation
Simpsonville, South Carolina
USA


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