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3D TSV-based Inductor Design for Secure Internet of Things
Keywords: Internet of Things, Inductors, Hardware Security
3D TSV-based Inductor Design for Secure Internet of Things: This paper describes design and modeling of a through silicon via (TSV) based high density 3D inductors for Internet of Things (IoT) applications. We present some possible challenges for TSV-based inductors in IoT applications. For cyber security infrastructure, we designed IoT with hardware security in mind. We provide secure design of Internet of Things which are based on secure 3D inductors. We provide some case studies of high density RF packages with TSV-based inductors that require hardware security such as military applications. We use ferromagnetic materials to achieve high inductance with good quality factor. The magnetic field lines within a metal core induce eddy current which can have multiple adverse effect in power electronics packaging. For example, it has long been known that the current can increase the resistance in transformer winding. Eddy current can also heat up the core of the inductor which makes the heat sink process in 3D packaging even more challenging. One way to decrease the eddy current, is to pattern and laminate the core block into multiple segments orthogonal to the direction of the magnetic field line. Another method is to increase the resistivity of the core material so that the eddy current is limited to a very small magnitude.
Bruce Kim,
City University of New York
New York, NY
USA


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