Here is the abstract you requested from the IMAPS_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Computer Aided Predictive Reliability Risk Analysis for High Temperature Operation of Subsurface Electronics Development|
|Keywords: Reliability, Environment Simulation and Modeling, Predictive Life Time|
|Designing a highly reliable Printed Circuit Board Assembly (PCBA) that can withstand high temperatures & vibration stress is a challenge faced by all downhole electronics designers in oil & gas industry today. Discussion will focus on the comprehensive Design for Reliability (DfR) Computer-aided design (CAD) tools, which can help with potentially analyzing electrical & thermal stress, service life prediction, and identify potential design errors for reliability improvement on the schematic-level early in the design cycle. The purpose of the analysis is twofold. The first is to identify design weaknesses and opportunities for reliability improvement. The second is to predict reliability for the intended mission and application (i.e. to pre-qualify design and validate reliability target) in the intended application. The goal of this analysis is to find opportunities for early design changes, to predict reliability for the mission and to minimize design iterations using DfR CAD tools. It could be a good solution to accelerate time-to-market, increases customer satisfaction and saves money as well. Combining to the result of the Finite Element Analysis (FEA) simulating the behaviour of engineering structures and components under a variety of conditions, the DfR CAD tools performs reliability risk assessment detects uncertain design errors, and provides MTBF predictions and Life predictions for the PCBA. This beneficial information could reduce the product design cost & time including the design qualification test, and improve PCBA repair & maintenance strategy based on historical failures (i.e. engineering practice). This paper will cover a case study used to evaluate this methodology and will also show how it can be used to support durability analysis at the early design stage. The methodology provided in this paper is used to effectively perform Stress-Based reliability prediction based on Electrical stress analysis to determine the power recommendations, Thermal stress analysis to determine the electric component derating and temperature distribution, and lastly, Dynamic stress analysis to prioritize the critical components under vibration load.|
|Josh J. Liew, Reliablity Manager
Baker Hughes Inc.