Here is the abstract you requested from the IMAPS_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Optimization of laser release layer, glass carrier, and organic build-up layer to enable RDL-first fan-out wafer-level packaging|
|Keywords: RDL-first fan-out , laser release layer, wafer-level packaging|
|As requirements increase for mobile devices to be lighter and thinner, consume less power, and operate at high speed and high bandwidth, many equipment suppliers and assembly participants have invested great efforts to achieve fine-line fan-out wafer-level packaging (FOWLP). However, the inherent warp of reconstituted wafers, which can contribute to poor die placement accuracy and/or delamination at the interface of the build-up layer and carrier, remains a major challenge. In this study, the interactions among laser release layer, glass carrier, and build-up layer were evaluated for optimization of redistribution layer (RDL)¡Vfirst FOWLP as a foundation to move toward fine-line FOWLP. A design of experiments (DOE) incorporating a glass carrier, a build-up layer, and a laser release layer was carried out to determine the optimal setup for RDL-first FOWLP. First, glass carriers (300 mm x 300 mm x 0.7 mm) with coefficients of thermal expansion of 3 ppm and 8 ppm were treated with 150-nm laser release layers. After deposition of 150 nm of Ti/Cu on the glass carrier, 8 £gm of PBO, the passivation layer, was coated and patterned by lithography to electroplate Cu interconnections with a density of approximately 10% of the surface area. Subsequent to die attachment, build-up layers or molding compound was applied on top to form a 200-£gm protective overcoat. The reconstituted wafer was then separated from the glass carrier through a laser ablation process using a 308-nm laser to complete the DOE. An experiment to study the correlation of glass carrier, laser release layer, and build-up layer in RDL-first FOWLP processes is discussed thoroughly to address full process integration on panel-size substrates. The combination of carrier substrate, laser release layer, and build-up layer will pave the way for realizing cost-effective RDL-first FOWLP on panel-size substrates.|
|Alvin Lee, Regional Deputy Director
Brewer Science, Inc.
Taipei, Not available