Here is the abstract you requested from the IMAPS_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Ultra-Thin Glass and photo sensitive glass ceramics for IC Packaging|
|Keywords: glass , interposer, IC Packaging|
|Glasses are homogeneous, many glasses have excellent dielectric properties at GHz frequencies and some have thermal expansions (CTE) which are close to silicon. Ultrathin glasses (UTG) with thicknesses of 25 m to 200 m (0.001 to 0.0079 inch) offer numerous options for packaging, integration and co-processing in semiconductor manufacturing processes. We introduce SCHOTT UTG including paths to further improve their mechanical stability and strength. We use laser ablation in 50m thick glass and show via fabrication with a potential of mass manufacturing with via diameters of 30m, 38m pitch and a position accuracy of +/- 1m. The structures are metallized using sputtering and electroplating which leads to hermetic, tight conducting through glass-vias (TGV).|