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Ultra-Thin Glass and photo sensitive glass ceramics for IC Packaging
Keywords: glass , interposer, IC Packaging
Glasses are homogeneous, many glasses have excellent dielectric properties at GHz frequencies and some have thermal expansions (CTE) which are close to silicon. Ultrathin glasses (UTG) with thicknesses of 25 m to 200 m (0.001 to 0.0079 inch) offer numerous options for packaging, integration and co-processing in semiconductor manufacturing processes. We introduce SCHOTT UTG including paths to further improve their mechanical stability and strength. We use laser ablation in 50m thick glass and show via fabrication with a potential of mass manufacturing with via diameters of 30m, 38m pitch and a position accuracy of +/- 1m. The structures are metallized using sputtering and electroplating which leads to hermetic, tight conducting through glass-vias (TGV).
Ruediger Sprengard,
SCHOTT AG
Mainz, RLP
Germany


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