Here is the abstract you requested from the IMAPS_2016 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Unique Silicon Passive Component Technology for Medical implants combining highly flexible integration with outstanding performances.|
|Keywords: miniaturization, medical devices, silicon capacitor|
|Many implantable medical devices such as pacemakers, cochlear implants and neurostimulation devices have been developed and tremendously improved in electrical power consumption, battery lifetime, functionality, system delivery, and wireless communication but there is still a lot of room for improvement and these devices are still facing challenges with size shrinkage and reliability. Many efforts have been engaged to miniaturize and to facilitate the implantation of the device in order to reduce the impact of the surgery. IPDiA’s technology is strongly contributing to this progress by providing passive components such as capacitor arrays or RC networks, with a high contribution to miniaturization, a very low profile, extremely low leakage and outstanding reliability. In this paper, the enablers such as design flexibility, co-integration, low leakage, extended life time will be presented and illustrated by several examples of solutions. Firstly, the recent progress in the capacitor technology development will be presented, secondly the impact of the component technology on the overall system size and performances through advanced packaging solutions will be highlighted together with other key differentiators and finally some of the applications where this technology is inescapable will be presented.|
|Catherine Bunel, Director, R&D