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Glass-Based SiP/SoC Devices using Photo-Sensitive Glass Ceramics
Keywords: glass, inteposer, SiP
Glassy materials offer a number of advantages over traditional packaging materials, such as laminates and ceramics, including: (1) better material properties, (2) decreased surface roughness to mitigate current crowding, (3) the ability to create small precise features with greater densities, and (4) the opportunity to integrate passive devices such as High-Q inductors into the interposer substrate itself along with other active and passive devices. Several glass manufacturing techniques are available on the market today for the formation of through glass vias (TGVs) for I/Os and interconnects, including laser ablation, electrostatic discharge, ultrasonic milling, and wet chemical etching. While each of these approaches have unique advantages, wet chemical etching offers a number of benefits. These include: (1) process simplicity, (2) low tool capital cost, (3) batch manufacturing for lower production costs, and (4) the decreased formation of micro-fractures between structures, commonly seen in processes that input high levels of thermal and mechanical stress to the glass. The presented work describes a photo-sensitive material that enables the production of highly anisotropic 3D structures in glass using photolithographic patterning, baking, and wet chemical etching. Photo-sensitive glasses offer a unique material set to build highly integrated Glass-based System-in-package and System-on-Chip devices for the RF, IoT, and Sensor industries. Photo-sensitive glasses enable a batch manufacturing method to create a variety of 3D structures in glass, including: through glass vias, cavities, fiber optic trenches, and other highly precise 3D structures in glass. Furthermore, photo-sensitive glasses offer the ability to integrate highly efficient passive devices, such as inductors and capacitors into an interposer platform for 2.5D and 3D electronics packaging. In this presentation, 3D Glass Solutions, presents on our efforts to build glass-based System-in-Package and System-on-Chip devices for the RF community using APEX® Glass. This photo-definable glass provides high-value system’s integration, combined with proven low-cost high-volume batch manufacturing, enabling significant product differentiation and new product definitions in SoC/SiP markets. We will present on our efforts to transition a printed circuit board RF device into a glass-based 2.5D RF interposers with (1) a 70% reduction of device size; (2) 30% less power consumption; and (3) 20% more RF emission efficiency. Additionally, we will present on our efforts for building embedded high quality-factor power inductors for RF applications. We will present simulation and testing results on 800μm x 800μm 1-5nH inductors with quality factors greater than 60 built in photo-sensitive materials. These inductors were tested using the Würth Elektronik testing methods [1], where maximum current handling is defined to increase device temperature 40C above ambient temerpature and were determined to handle current loads above 3.0 amps with peak amperage measured at 20 Amps. Finally, we present on how these types of devices are integrated into glass-based System-in-Package and System-on-Chip systems.
Jeb H Flemming, Chief Technology Officer
3D Glass Solutions
Albuquerque, New Mexico
USA


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